Kester® Soldering Flux with Liquid, 1.14 g/cm³ Density, 15 g/L VOCs, Plastic Can, 53 gal Capacity
| Brand | Kester® |
|---|---|
| Product Type | Soldering Flux |
| Physical Form | Liquid |
| Chemical Composition | Glycolic Acid;2-Aminoethanol;2-Butoxyethanol;Organic;Water |
| Density | 1.14 g/cm³ |
| Shelf Life | 1 yr |
| Odor | Mild |
| Flash Point | >100 °C |
| Applications | Soldering |
| VOCs Content | 15 g/L |
| Container Type | Plastic Can |
| Capacity | 1;53 gal |
Kester 2166-BN is a halide-free, organic flux designed for automated soldering of circuit board assemblies. This flux provides good activity on both bare copper and solder coated boards. The absence of chlorides, bromides, phosphates and highly corrosive materials facilitates removal after soldering. 2166-BN provides better surface insulation resistance than typical water-soluble fluxes, making it particularly suitable for surface mount assemblies. 2166-BN provides better chemical compatibility with solder resists than other water-soluble fluxes. It is free of volatile organic compounds. This eliminates the use of ozone depleting chemicals and volatile organic compounds contained in the flux removal solvents. 2166-BN flux produces bright, shiny solder joints and the residue after soldering is effectively removed in standard water cleaning systems.
- High-reliability flux showing highest SIR values under the most extreme test conditions
- Utilized in a nitrogen atmosphere
- This flux shows hardly any visible residues